Solder Powder Ultrasonic Sieve

In solder paste manufacturing, fine solder powder is inherently sticky and prone to electrostatic agglomeration. Traditional vibrating screen equipment cannot break up the electrostatic adsorption and agglomeration between the powder particles, leading to sluggish sieving. The Solder Powder Ultrasonic Sieve uses a mechanically vibrating base superimposed with high-frequency micro-amplitude waves to cause the tiny metal particles on the screen to be suspended in a low-altitude state, keeping the flow channels unobstructed.

The ultrasonic sieve can operate on a mesh size range from 200 to 635 mesh, and can handle fine solder powder of Type 3, Type 4, Type 5, and Type 6 specifications with diameters between 15 and 75 micrometers. This system solves the problems of micron-sized powder sticking to the screen, agglomeration, and low classification efficiency.

Solder Powder Ultrasonic Sieve Components

The bottom of the device is driven by a vibration source motor for three-dimensional gravity vibration. The material contact surface is made of 316L stainless steel and has been mirror-polished with low residue. Its electronic unit consists of an ultrasonic generator and an external transducer. The external configuration isolates the conductive heat, preventing the solder powder from overheating and oxidizing. During operation, the high-frequency electrical signal is converted by the transducer into longitudinal mechanical vibrations of 33,000 to 40,000 times per second, which are amplified throughout the entire wire mesh through the conduction circuit. This high-frequency acceleration prevents fine solder powder from remaining on the wire mesh, directly breaking the electrostatic adsorption and clumping between particles, and dislodging critically stuck particles, maintaining unobstructed flow.

Advantages of the Solder Powder Ultrasonic Sieve

When classifying solder powder through meshes of 400 mesh or finer, the ultrasonic solder powder sieve can control the particle size within a narrow range, removing large foreign objects and excessively fine powder. The system eliminates the need for traditional rubber bouncing balls, avoiding physical wear and secondary contamination of the metal wire mesh and extending the sieve's lifespan. Because the micro-vibration process is gentle, the solder powder will not undergo physical deformation due to violent impacts, preserving the original spherical fullness of the solder powder. With its external ionizer configuration, the surface temperature rise is controlled to an extremely low range, blocking heat conduction and protecting the metal surface from chemical oxidation.

Solder Powder Ultrasonic Sieve Applications

Ultrasonic solder powder sieves are primarily used for high-precision powder processing. In SMT solder paste manufacturing, it is responsible for classifying the raw alloy powder produced by atomization, extracting 20-38 micron T4 grade or 15-25 micron T5 grade finished products. For microelectronic semiconductor packaging, it can be used for final impurity filtration in the preparation of ultrafine T6 grade tin powder required for micro-pitch wafer-level soldering. In the field of metal 3D printing, it is suitable for the secondary recovery and purification of spherical metal powders such as titanium alloys and tin alloys required for micro-additive manufacturing.

Model Specifications

How much does a Solder Powder Ultrasonic Sieve cost?

The basic price of an ultrasonic solder powder sieve ranges from $1050 to $3828, with price variations depending on structural configuration, sealing performance, and customization requirements. Because fine metal powder poses a risk of deflagration at certain concentrations in air, selecting explosion-proof certified motors, control boxes, and anti-static grounding devices will increase costs by $650 to $1350. Adding nitrogen charging ports, gas control valves, and oxygen content monitoring sensors to create a fully enclosed, oxidation-resistant environment will increase costs by $1100 to $2200. Using imported ultrasonic generators and transducers with more continuous signal output and higher heat resistance will also increase prices.

Frequently Asked Questions

Q: Why must an external transducer be used for tin powder grading instead of an internal one?

A: An internal transducer, placed inside the mesh frame, will have direct physical contact with the tin powder. The transducer generates slight heat during continuous operation, which can easily cause surface oxidation of the tin powder and even lead to micro-melting and adhesion. An external structure completely isolates the heat source from the material, ensuring the stability of its physical properties.

Q: What role does the nitrogen protection system play in sieving?

A: Tin is chemically very reactive at the micron level. Nitrogen purging protection involves injecting nitrogen into the fully enclosed casing to expel oxygen. The machine can only be started when the internal oxygen concentration is below a set level. This prevents solder powder from contacting oxygen and forming oxide scale during rapid flow, ensuring the soldering performance of downstream solder paste.

Q: Is it easy to clean the equipment if switching from T4 powder to T5 powder sieving?

A: The equipment uses a quick-opening clamp design, allowing operators to loosen the clamps and remove the screen frame within 5 minutes. Because the entire interior is mirror-polished, there are no dead corners or residues. Cleaning can be completed using alcohol spraying combined with air gun blowing, preventing cross-contamination between different batches.

The Solder Powder Ultrasonic Sieve solves the problems of impermeability, adhesion, and clogging of micron-sized metal powders during production by relying on high-frequency micro-amplitude vibration waves. Through its heat-resistant external ionizer configuration, fully enclosed nitrogen-purging anti-oxidation structure, and controllable explosion-proof configuration, it provides a reliable particle size classification method for the high-end electronics and microelectronics industry. Understanding its internal components, anti-blocking mechanisms, and customized modules that affect price allows for the selection of appropriate equipment solutions based on production capacity needs and nature requirements.